PCBA Manufacturing Capabilities
Highest complexities at the fastest turnarounds
Our printed circuit board assembly (PCBA) capabilities include rigid, HDI, stacked micro-vias, fine-pitch BGA and QFN assembly. See below to understand the price, lead time, and DFM implications of your design decisions. Tempo Automation has IPC class 2 and class 3 production, is ISO9001:2015, AS9100D, and ISO13485:2016 certified, and is ITAR registered. For a complete list see the Certifications and Registrations page.
Sourcing Overview
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- Real time stock visibility with integrated components suppliers
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- Over 8 million components with overnight delivery
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- Customer specified vendors, consigned components
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- Component cross and life cycle tracking
Fabrication Overview
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- Rigid
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- 2-40 layers
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- 3mil trace and space
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- Blind, buried, and stacked vias
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- HDI, micro-vias, controlled impedance
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- 20in x 16in board area
Assembly Overview
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- High Complexity - 1000+ SMT placements
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- 01005 to 3in x 3in packages
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- .3mm pitch BGA and CSP
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- Through hole, press fit, and edge mount components
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- Lead forming
Testing Overview
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- Functional testing
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- In-circuit testing (ICT)
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- Flying probe
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- ROSE iconic cleanliness testing
