PCBA Manufacturing Capabilities
Highest complexities at the fastest turnarounds
Our printed circuit board assembly (PCBA) capabilities include rigid, HDI, stacked micro-vias, fine-pitch BGA and QFN assembly. See below to understand the price, lead time, and DFM implications of your design decisions. For a complete list see the Certifications and Registrations page.
Capabilities Overview
Sourcing
- Real time stock visibility with integrated components suppliers
- Over 8 million components with overnight delivery
- Customer specified vendors, consigned components
- Component cross and life cycle tracking
Fabrication
- Rigid
- 2-40 layer boards
- 3mil trace and space
- Blind, buried, and stacked vias
- HDI, micro-vias, controlled impedance
- 19in x 20in board area
Assembly
- High Complexity - 1000+ SMT placements
- 01005 to 3in x 3in packages
- .3mm pitch BGA and CSP
- Through hole, press fit, and edge mount components
- Lead forming
Testing
- Functional testing
- In-circuit testing (ICT)
- Flying probe tests
- ROSE ionic cleanliness testing
Tempo Automation has IPC class 2 and class 3 production, is ISO9001:2015, AS9100D, and ISO13485:2016 certified, and is ITAR registered. For a complete list see the Certifications and Registrations page.