Tempo Capabilities

Highest complexities at the fastest turnarounds

Our capabilities include rigid, HDI, stacked micro-vias, fine-pitch BGA and QFN assembly. See below to understand the price, lead time, and DFM implications of your design decisions. Tempo Automation has IPC class 2 and class 3 production, is ISO9001:2015, AS9100D, and ISO13485:2016 certified, and is ITAR registered. For a complete list see the Certifications and Registrations page.

Sourcing Overview

  • Real time stock visibility with integrated components suppliers

  • Over 8 million components with overnight delivery

  • Customer specified vendors, consigned components

  • Component cross and life cycle tracking

Fabrication Overview

  • Rigid

  • 2-40 layers

  • 3mil trace and space

  • Blind, buried, and stacked vias

  • HDI, micro-vias, controlled impedance

  • 20in x 16in board area

Assembly Overview

  • High Complexity - 1000+ SMT placements

  • 01005 to 3in x 3in packages

  • .3mm pitch BGA and CSP

  • Through hole, press fit, and edge mount components

  • Lead forming

Get in touch and explore what’s possible.

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