Tempo Capabilities

Highest complexities at the fastest turnarounds

Our capabilities include rigid, HDI, stacked micro-vias, fine-pitch BGA and QFN assembly. See below to understand the price, lead time, and DFM implications of your design decisions. Tempo Automation has IPC class 2 and class 3 production, is ISO9001:2015, AS9100D, and ISO13485:2016 certified, and is ITAR registered. For a complete list see the Certifications and Registrations page.

Sourcing Overview

  • - Real time stock visibility with integrated components suppliers

  • - Over 8 million components with overnight delivery

  • - Customer specified vendors, consigned components

  • - Component cross and life cycle tracking

Fabrication Overview

  • - Rigid

  • - 2-40 layers

  • - 3mil trace and space

  • - Blind, buried, and stacked vias

  • - HDI, micro-vias, controlled impedance

  • - 20in x 16in board area

Assembly Overview

  • - High Complexity - 1000+ SMT placements

  • - 01005 to 3in x 3in packages

  • - .3mm pitch BGA and CSP

  • - Through hole, press fit, and edge mount components

  • - Lead forming

Testing Overview

  • - Functional testing

  • - In-circuit testing (ICT)

  • - Flying probe (third-party service)

  • - ROSE iconic cleanliness testing

Get in touch and explore what’s possible.

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