Tempo Capabilities

Highest complexities at the fastest turnarounds

Our capabilities include rigid, rigid-flex, flex, HDI, stacked micro-vias, fine-pitch BGA and QFN assembly. See below to understand the price and delivery implications of your design decisions. Within each section, the base cost and lead time options are shown with a single "$" icon and single "🕐" icon. Options with a relative higher costs or lead time will be shown with 2 or 3 "$" or "🕐" icons.

Rigid

  • 2- 64 Layers

  • 3mil Trace and Space

  • Blind, Buried, and Stacked Vias

  • .3mm pitch BGA and CSP

  • 16in x 22in Panel Size

Rigid-Flex

  • 4 - 20 Layers

  • 01005 smallest passive size

  • Conformal coating

  • .3mm pitch BGA and CSP

  • Underfill

  • Cable replacement

Flex

  • 2 - 20 Layer

  • 2mil trace and space

  • Blind, Buried, and Stacked Vias

  • 2 - 5mil board thickness

  • Laser routing

Rigid
Flex
Assembly

Construction

Processes

Processes

Single Bonding, Sequential Bonding, Hybrid Bonding, HDI, ELIC

Processes

Cost Time
Single Bonding Rigid
Rigid Flex
Sequential Bonding
Hybrid Bonding
Metal Core
HDI
ELIC

Material

Type

Type

FR4 370HR, FR406, FR408, FR408HR, G200, GETEK, GreenSpeed, IS410, IS415, IS620i, IS680, P95-P25 Polyimide, P95-P26 Polyimide, Rogers 4350B, Rogers 4003, Custom Material

Type

Cost Time
FR4 370HR Data Sheet
FR406 Data Sheet
FR408 Data Sheet
FR408HR Data Sheet
G200 Data Sheet
GETEK Data Sheet
GreenSpeed Data Sheet
IS410 Data Sheet
IS415 Data Sheet
IS620i Data Sheet
IS680 Data Sheet
P95-P25 Polyimide Data Sheet
P95-P26 Polyimide Data Sheet
Rogers 4350B Data Sheet
Rogers 4003 Data Sheet
Custom Material? - - Chat
Impedance

Impedance

Uncontrolled, Controlled Dielectric, Controled Impedance ±10%, Controled Impedance < ±10%

Impedance

Cost Time
Uncontrolled
Controlled Impedance ±10%
Controlled Impedance < ±10%
Controlled Dielectric

Traces

Width and Spacing

Width and Spacing

Minimum .002"

Width and Spacing

Cost Time
> .003"
.003"
.0025"
0.002"
Clearance to board edge (minimum):

Clearance to board edge (minimum):

0.010"

Board Dimension

Layer Count

Layer Count

2 - 64 layer

Layer Count

Cost Time
up to 8
up to 18
18 - 64
Size

Size

.02in x 0.02in - 16in x 22in

Size

Cost Time
.02in x 0.02in - 6in x 6in
6in x 6in - 16in x 22in
Dimensional Tolerance

Dimensional Tolerance

+/- 0.003"

Bow & twist tolerance:

Bow & twist tolerance:

< 7%

Shape

Shape

Unrestricted

Board Thickness

Board Thickness

.013in to .250in

Board Thickness

Cost Time
.013 to .031
.031, .062
0.093
.063 - .125
.125 - .250
Thickness Tolerance

Thickness Tolerance

+/- 10%

Holes

Via Options

Via Options

Through Exposed, Through Tented, Via In Pad, Blind, Buried, Stacked

Via Options

Cost Time
Through Exposed
Through Tented
Via In Pad
Blind
Buried
Stacked
Hole Diameter (Mechanical Drill)

Hole Diameter (Mechanical Drill)

.006in - .250in

Hole Diameter (Mechanical Drill)

Cost Time
.010in - .250in
.006in - .010in
Drill Features

Drill Features

Countersunk, Counterbored

Drill Features

Cost Time
Countersunk
Counterbored
Slot Features

Slot Features

Beveled, Castellated, Controlled depth

Slot Features

Cost Time
Beveled
Castellated
Controlled depth
Hole Fill

Hole Fill

Solder Mask Plug, Conductive, Non-Conductive

Hole Fill

Cost Time
Solder Mask Plug
Conductive
Non-Conductive
Mechanical Drill Aspect Ratio

Mechanical Drill Aspect Ratio

10/1, 15/1, 20/1

Mechanical Drill Aspect Ratio

Cost Time
10/1
15/1
20/1
Annular Ring Width

Annular Ring Width

Minimum 0.002in

Annular Ring Width

Cost Time
0.002in
0.003in
>0.003in
Finished Tolerance

Finished Tolerance

=+/- 0.003"

Micro-Via Diameter (Laser Drill)

Micro-Via Diameter (Laser Drill)

0.002in - .005in

Micro-Via Diameter (Laser Drill)

Cost Time
0.002in - .003in
0.004in - .005in
Laser Drill Aspect Ratio

Laser Drill Aspect Ratio

.5/1 - 2/1

Laser Drill Aspect Ratio

Cost Time
.5/1 - .75/1
2/1
Stackup

Stackup

Standard, Custom

Stackup

Cost Time
Standard - - Link to stackup page
Custom - - Chat

Surface Finish

Types

Types

Leaded HASL, Lead Free HASL, ENIG, ENEPIG, Immersion Silver, Wire Bondable Gold, OSP, Hard Gold, Selective Gold

Types

Cost Time
Electroless Nickel Immersion Gold (ENIG)
Leaded Hot Air Solder Leveling (HASL)
Lead Free Hot Air Solder Leveling (HASL)
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Immersion Silver
Wire Bondable Gold (Electrolytic)
Organic Solder Preservative (OSP)
Hard Gold Selective Gold (Electrolytic)

Copper Weight

Inner Layer Copper

Inner Layer Copper

.5oz -7oz

Inner Layer Copper

Cost Time
.5oz
1-2oz
2-3oz
3-4oz
4-7oz
Thickness (minimum):

Thickness (minimum):

.35mil

Outer Layer Copper

Outer Layer Copper

.5oz -7oz

Outer Layer Copper

Cost Time
.5oz
1-1.5oz
2-2.5oz
3-4oz
4.5-7oz
Thickness (minimum):

Thickness (minimum):

.35mil

Solder Mask

Color

Color

Green, Orange, Red, Yellow, Blue, Purple, Black, White, Clear, Peelable

Color

Cost Time
Green
Orange
Red
Yellow
Blue
Purple
Black
White
Clear
Peelable
Pad Relief (minimum):

Pad Relief (minimum):

0.001"

Mask dam (minimum):

Mask dam (minimum):

0.005"

Silkscreen

Color

Color

White, Black, Yellow, Red, Blue

Color

Cost Time
White
Black
Yellow
Red
Blue
Character width (minimum):

Character width (minimum):

0.004"

Character height (minimum):

Character height (minimum):

0.015"

Quality Assurance

Processes

Processes

Flying Probe, Time Domain Reflectometry

Processes

Cost Time
Flying Probe
Time Domain Reflectometry

Construction

Processes

Processes

Single Bonding, Sequential Bonding, Hybrid Bonding

Processes

Cost Time
Single Bonding Flex
Rigid Flex
Sequential Bonding
Hybrid Bonding
HDI

Material

Type

Type

Pyralux Copper Clad, P95-P25 Polyimide, P95-P26 Polyimide, Pyralux Coverlay, Custom Material

Type

Cost Time
Pyralux Copper Clad Data Sheet
P95-P25 Polyimide Data Sheet
P95-P26 Polyimide Data Sheet
Pyralux Coverlay Data Sheet
Custom Material? - - Chat
Impedance

Impedance

Uncontrolled, Controlled Dielectric, Controled Impedance ±10%, Controled Impedance < ±10%

Impedance

Cost Time
Uncontrolled
Controlled Dielectric
Controled Impedance ±10%
Controled Impedance < ±10%

Traces

Trace and space

Trace and space

Minimum .002

Trace and space

Cost Time
>.002
0.002
Clearance to board edge (minimum):

Clearance to board edge (minimum):

0.005"

Board Dimension

Layer Count

Layer Count

2 - 20

Layer Count

Cost Time
up to 8
8 to 20
Board Dimensions

Board Dimensions

.02in x 0.02in - 16in x 22in

Board Dimensions

Cost Time
.02in x 0.02in - 16in x 22in
6in x 6in - 16in x 22in
Dimensional Tolerance

Dimensional Tolerance

+/- 0.003"

Shape

Shape

Unrestricted

Board Thickness

Board Thickness

.002in to .008in

Board Thickness

Cost Time
.002in-.008in
Thickness Tolerance

Thickness Tolerance

+/- 10%

Holes

Via Options

Via Options

Through Exposed, Through Tented, Via In Pad, Blind, Buried, Stacked

Via Options

Cost Time
Through - Exposed
Through Tented
Via In Pad
Blind
Buried
Stacked
Hole Diameter (Mechanical Drill)

Hole Diameter (Mechanical Drill)

0.006in - 0.250in

Hole Diameter (Mechanical Drill)

Cost Time
.010in - .250in
.06in - .010in
Hole Fill

Hole Fill

Solder Mask Plug, Conductive, Non-Conductive

Hole Fill

Cost Time
Solder Mask Plug
Conductive
Non-Conductive
Mechanical Drill Aspect Ratio

Mechanical Drill Aspect Ratio

10/1, 15/1, 20/1

Mechanical Drill Aspect Ratio

Cost Time
10/1
15/1
20/1
Annular Ring Width

Annular Ring Width

Minimum 0.002in

Annular Ring Width

Cost Time
0.002in
0.003in
>0.003in
Finished Tolerance

Finished Tolerance

+/- 0.002"

Micro-Via Diameter (Laser drill)

Micro-Via Diameter (Laser drill)

0.002in - 0.005in

Micro-Via Diameter (Laser drill)

Cost Time
0.002in - .003in
0.004in - .005in
Laser Drill Aspect Ratio

Laser Drill Aspect Ratio

.5/1 - 2/1

Laser Drill Aspect Ratio

Cost Time
.5/1 - .75/1
2/1
Stackup

Stackup

Custom

Stackup

Cost Time
Custom - - Chat

Surface Finish

Types

Types

Leaded HASL, Lead Free HASL, ENIG, ENEPIG, Immersion Silver, Wire Bondable Gold, Organic Solder Preservative (OSP), Hard Gold, Selective Gold

Types

Cost Time
Electroless Nickel Immersion Gold (ENIG)
Leaded Hot Air Solder Leveling (HASL)
Lead Free Hot Air Solder Leveling (HASL)
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Immersion Silver
Wire Bondable Gold (Electrolytic)
Organic Solder Preservative (OSP)
Hard Gold Selective Gold (Electrolytic)

Copper Weight

Inner Layer Copper

Inner Layer Copper

1/3oz - 2oz

Inner Layer Copper

Cost Time
1/3 oz
1/2 oz
1 oz
2 oz
Thickness (minimum):

Thickness (minimum):

.35mil

Outer Layer Copper

Outer Layer Copper

1/3oz - 2oz

Outer Layer Copper

Cost Time
1/3 oz
1/2 oz
1 oz
2 oz
Thickness (minimum):

Thickness (minimum):

.35mil

Solder Mask

Solder Mask Color

Solder Mask Color

Amber Coverlay, Black Coverlay, White Coverlay, Soldermask (LPI)

Solder Mask Color

Cost Time
Amber Coverlay
Black Coverlay
White Coverlay
Soldermask (LPI)
Solder mask relief (minimum):

Solder mask relief (minimum):

0.001"

Mask dam (minimum):

Mask dam (minimum):

0.005"

Silkscreen

Silkscreen Color

Silkscreen Color

White, Black, Yellow, Red, Blue

Silkscreen Color

Cost Time
White
Black
Yellow
Red
Blue
Character width (minimum):

Character width (minimum):

0.004"

Character height (minimum):

Character height (minimum):

0.015"

Quality Assurance

Quality Assurance

Quality Assurance

Flying Probe, Time Domain Reflectometry

Quality Assurance

Cost Time
Flying Probe
Time Domain Reflectometry

Construction

Processes

Processes

Full Turn Key, Partial Consignment, Split Assembly, Fabrication Only

Processes

Cost Time
Full Turn Key
Partial Consignment
Split Assembly
Fabrication Only

Components

Packages

Packages

01005 Passives, Throughhole, Chip Scale Packages (CSP), Package on Packages, Embedded components

Packages

Cost Time
01005 Passives
Throughhole
Chip Scale Packages (CSP)
Package on Packages
Embedded components
Minimum Pitch

Minimum Pitch

.2mm pitch QFP, .3mm pitch BGA, .2mm pitch QFN

Minimum Pitch

Cost Time
.2mm pitch QFP
.3mm pitch BGA
.2mm pitch QFN

Solder Paste

Type

Type

AIM SAC305 NC 257MD, AIM Sn63-Pb37 NC 257MD, ECO SOLDER PASTE

Type

Cost Time
AIM SAC305 Data Sheet
AIM Sn63-Pb37 Data Sheet
AIM SN100C Data Sheet
SMIC M705 Data Sheet
AIM NC 257MD Data Sheet

Quality Assurance

Processes

Processes

Component Inspection, Component Value Check, Automatic Optical Inspection, X-ray inspection, Ionic Contamination, Post Assembly Check

Processes

Cost Time
Component Inspection
Component Value Check
Automatic Optical Inspection
X-ray inspection
Ionic Contamination Test
Post Assembly Check
Flying Probe

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