Board Level
Additional Processes
- Press Fit
- Lead Forming
- Staking
- Underfill
- Flying Probe Testing
- Functional Testing
- Conformal Coat
Assembly Processes
- Leaded Process
- Lead Free Process
- Clean or No Clean Flux Process
- Inline Wash
- State-of-the-Art SMT
- Robotic Through Hole
Board DIMENSIONS
Standard Review:
MAXIMUM
19in x 20in
48.3cm x 50.8 cm
Additional Review:
MAXIMUM
19in x 23in
48.3cm x 58.4 cm
Depanelization
Tempo uses a CNC auto-router to depanel boards, providing a perfect mechanical edge.
Quality Control
- Component Inspection
- Component Value Check
- Solder Paste Inspection
- In-Line AOI
- X-Ray Inspection
- Ionic Contamination Test
Packages
Package Size Minimum
Standard Review:
0201
Additional Review:
01005
Package Type
All modern package types generally supported, including:
- SOIC
- QFP
- QFN
- TQFN
- BGA
- CGA
- LGA
- Flip Chip
- CSP
- Through Hole
Part to Part Clearance
Standard Review:
6mil – 16mil
0.15mm – 0.41mm
Additional Review:
3mil – 6mil
0.08mm – 0.15mm
Pin Pitch
Standard Review:
15mil – 25mil
0.36mm – .64mm
Additional Review:
4mil – 15mil
0.10mm – 0.36mm
Placements Per Board
Standard Review:
250 – 2,500
Additional Review:
2,500+