Design for Manufacturing (DFM) Checks

We know that getting high quality boards, on time, matters. Designing your boards in such a way to avoid manufacturing pitfalls is essential to achieving this goal. To help, we check for the following DFM issues before and during production.

If our boards violate IPC standards due to any of the following DFM issues, we will make them again for free.

Fabrication Issues

Trace layers:

  • Incomplete Files
  • Minimum Trace & Space Violations
  • Netlist shorts and/or broken circuits
  • Non-plated through holes to copper
  • Minimum distance from copper feature to route
  • Distance from cut-out and mill to copper
  • Landless pads, which are pads that are not connected to any traces
  • Pads outside the route path
  • Empty layers due to bad conversion
  • Disconnected traces
  • Via in SMT pads
  • Controlled impedance requirements not met

Solder Mask Layer:

  • Solder Mask pad clearance
  • Solder Mask minimum web
  • Solder Mask missing pad clearance
  • Solder Mask bridging clearance
  • Extra Solder Mask clearance in unintended regions
  • Missing Solder Mask clearance for Planted or non-plated through holes
  • Missing Solder Mask clearance for test points
  • Solder Mask covering plated edges
  • Solder Mask clearance exposing traces
  • Solder Mask slivers

Positive/negative plane:

  • Minimum distance from drill to copper
  • Non-plated through holes to copper distance
  • Copper slivers
  • Acid traps, copper features at an acute angle that may cause chemical entrapment
  • Proper copper balancing
  • Unintended copper connections and misconnected traces
  •  Netlist shorts and/or broken circuits


Silkscreen Layer:

  • Silkscreen overlapping solder mask free regions (such as pads)
  • Minimum Silkscreen feature width manufacturable
  • Silkscreen unreadable

Assembly Issues:

  • Via-In-Pad
  • Component to pad mismatch (SMT & PTH)
  • Via to pad or shared pads with no solder dams
  • Missing solder dams
  • Gang masking fine pitch or leadless components
  • Side mounted parts (straddling edge of PCB)
  • Silkscreen over pad errors
  • Component clearance to PCB edge
  • Component clearance to adjacent components
  • RoHS/Leaded component conflict with process (e.g. lead balled BGA for RoHS process)
  • Moisture sensitive components
  • Temperature sensitive components
  • Insufficient or poor support for flex circuits
  • Insufficient thermal relief for SMT & PTH pads
  • Component pin 1 or clear polarity identification (diodes, electrolytic/tantalum capacitors, etc.)
  • Missing solder mask relief from pads (typical 3 mil)

What Our Customers Are Saying

Planning a trip to the Bay Area?

We'd love an opportunity to give you a factory tour, just click the button below to book your visit.

Search Sign In