Design for Manufacturing (DFM) Checks
Fabrication Issues
Trace layers:
- Incomplete Files
- Minimum Trace & Space Violations
- Netlist shorts and/or broken circuits
- Non-plated through holes to copper
- Minimum distance from copper feature to route
- Distance from cut-out and mill to copper
- Landless pads, which are pads that are not connected to any traces
- Pads outside the route path
- Empty layers due to bad conversion
- Disconnected traces
- Via in SMT pads
- Controlled impedance requirements not met
Solder Mask Layer:
- Solder Mask pad clearance
- Solder Mask minimum web
- Solder Mask missing pad clearance
- Solder Mask bridging clearance
- Extra Solder Mask clearance in unintended regions
- Missing Solder Mask clearance for Planted or non-plated through holes
- Missing Solder Mask clearance for test points
- Solder Mask covering plated edges
- Solder Mask clearance exposing traces
- Solder Mask slivers
Positive/negative plane:
- Minimum distance from drill to copper
- Non-plated through holes to copper distance
- Copper slivers
- Acid traps, copper features at an acute angle that may cause chemical entrapment
- Proper copper balancing
- Unintended copper connections and misconnected traces
- Netlist shorts and/or broken circuits
Silkscreen Layer:
- Silkscreen overlapping solder mask free regions (such as pads)
- Minimum Silkscreen feature width manufacturable
- Silkscreen unreadable
Assembly Issues:
- Via-In-Pad
- Component to pad mismatch (SMT & PTH)
- Via to pad or shared pads with no solder dams
- Missing solder dams
- Gang masking fine pitch or leadless components
- Side mounted parts (straddling edge of PCB)
- Silkscreen over pad errors
- Component clearance to PCB edge
- Component clearance to adjacent components
- RoHS/Leaded component conflict with process (e.g. lead balled BGA for RoHS process)
- Moisture sensitive components
- Temperature sensitive components
- Insufficient or poor support for flex circuits
- Insufficient thermal relief for SMT & PTH pads
- Component pin 1 or clear polarity identification (diodes, electrolytic/tantalum capacitors, etc.)
- Missing solder mask relief from pads (typical 3 mil)
Tempo Automation In
April 17, 2018
Series B Announcement
February, 2018
Top 20 Solution Providers
May 30, 2017
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June 29, 2016
Series A Announcement
What Our Customers Are Saying
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