Design for Manufacturing (DFM) Checks

Fabrication Issues

Trace layers:

Incomplete Files
Minimum Trace & Space Violations
Netlist shorts and/or broken circuits
Non-plated through holes to copper
Minimum distance from copper feature to route
Distance from cut-out and mill to copper
Landless pads, which are pads that are not connected to any traces
Pads outside the route path
Empty layers due to bad conversion
Disconnected traces
Via in SMT pads
Controlled impedance requirements not met

Solder Mask Layer:

Solder Mask pad clearance
Solder Mask minimum web
Solder Mask missing pad clearance
Solder Mask bridging clearance
Extra Solder Mask clearance in unintended regions
Missing Solder Mask clearance for Planted or non-plated through holes
Missing Solder Mask clearance for test points
Solder Mask covering plated edges
Solder Mask clearance exposing traces
Solder Mask slivers

Positive/negative plane:

Minimum distance from drill to copper
Non-plated through holes to copper distance
Copper slivers
Acid traps, copper features at an acute angle that may cause chemical entrapment
Proper copper balancing
Unintended copper connections and misconnected traces
Netlist shorts and/or broken circuits

Silkscreen Layer:

Silkscreen overlapping solder mask free regions (such as pads)
Minimum Silkscreen feature width manufacturable
Silkscreen unreadable

Assembly Issues:

Via-In-Pad
Component to pad mismatch (SMT & PTH)
Via to pad or shared pads with no solder dams
Missing solder dams
Gang masking fine pitch or leadless components
Side mounted parts (straddling edge of PCB)
Silkscreen over pad errors
Component clearance to PCB edge

Component clearance to adjacent components
RoHS/Leaded component conflict with process (e.g. lead balled BGA for RoHS process)
Moisture sensitive components
Temperature sensitive components
Insufficient or poor support for flex circuits
Insufficient thermal relief for SMT & PTH pads
Component pin 1 or clear polarity identification (diodes, electrolytic/tantalum capacitors, etc.)
Missing solder mask relief from pads (typical 3 mil)

Tempo Automation In

April 17, 2018

Series B Announcement

February, 2018

Top 10 Manufacturing Disruptors

June 29, 2016

Series A Announcement

What Our Customers Are Saying

Spire

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Lead Embedded Engineer

Consumer Electronics Company

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Electrical Engineer

Consumer Electronics Company

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Product Development Engineer

Aerospace company

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Electrical Engineer

GE Healthcare Life Sciences

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Jason Metzner

Lead Electrical Engineer

Invention Lab

“Tempo is one of those rare services that's so good, I’m almost hesitant to recommend them to others since they provide such a competitive advantage to us…”